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The new EZ BoardWare range of
surface mount products, from Harwin,
is designed to enhance manufacturing flexibility, reduce manufacturing
costs and improve in field maintenance.
Wendy Bourne, Technical Support Engineer at Harwin, comments Often,
relatively simple issues can frustrate good board design and cause
manufacturing delays and costs. Traditional methods used to solve
cable management, test and EMC problems often require secondary,
manual processing. EZ BoardWare components can all be surface mounted
along with other components, saving space as well as reducing time
and costs.
In the case of EMC, shielding cans are usually soldered to the board
as a secondary operation after the main automated assembly process.
However, EZ-Shield Clips can be surface mounted, allowing a shielding
can to be simply pressed into place during final assembly; and EZ-RFI
Fingers are sufficiently versatile to allow for a sliding or wiping
contact, and facilitate electrical contact between PCB and metal
cases, etc, while affording savings in manufacturing costs by comparison
with grounding finger strips.
In cable management, EZ-Cable Clips are much smaller and lower profile
than equivalent plastic devices. They are placed directly onto solder
pads, thus negating the need to drill retaining holes in the PCB,
so offering further space and cost savings.
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SM Products to enhance manufacturing flexibility, reduce manufacturing costs and improve in field maintenance.
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Similarly, EZ-Jumper Links can obviate the need for drilling.
Surface mount assembly reduces costs, and quality is improved through
using proven, controlled manufacturing processing.
Finally, EZ-Test Points provides technicians with easy-to-see test
points and minimize the risk of PCB damage by incorrect test methods.
Again, surface mount assembly cuts costs.
t: +44-2392 314 532
e: bgreen@harwin.co.uk
w: www.harwin.com
EDI-new-products
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